| 摘要 |
PROBLEM TO BE SOLVED: To unload a wafer in general regardless of the variations in the thickness of a wafer. SOLUTION: A wafer-unloading device 11 is provided with a pivot 12, which enables vertical positioning to an elevator E1 and is formed so that an unloading guide 13 supported in an upper end of the pivot 12 approaches the side of the elevator E1 as a tilting surface 14 slopes down. Guide rollers 15, 16, 17 of the upper, middle and lower steps are arranged in an end part of a tilting surface side of the unloading guide 13 and are pivoted rotatatively. When a wafer 1 is unloaded from a slot 9 of a cassette 54, the wafer 1 is unloaded after it has been shifted in a direction of an opening 6 of the cassette 54. Since it is thereby possible to realize a horizontal state by eliminating inclination, depending on the deflection of the shifted wafer 1 due to its dead weight, an insertion margin of a hand which is an interval between upper and lower wafers can be kept constant. Versatility can be improved by keeping the insertion margin of a hand fixed in this way. |
