| 摘要 |
PROBLEM TO BE SOLVED: To reduce or prevent the warp of a mounting structure to improve the reliability after mounting by reducing the thickness of a resin on a semiconductor chip to that of the chip or less. SOLUTION: A semiconductor device comprises a semiconductor chip 2 which is overlaid on an insulative film 1 having electrode pads and sealed with a seal resin 3. In this form the chip 2 is adhered to the film 1, using a thermoplastic polyimide 1a. The resin 3 seals the back surface of the film 1 and chip 2. The resin 3 just above the chip 2 has a thickness a1 and the chip 2 has a thickness a2; a1=a2 or a1<a2. In such semiconductor device, the warp of the device itself or a mounting structure of the device due the thermal expansion coefficient different between the chip 2 and resin 3 is reduced or prevented to improve the reliability after mounting. |
