| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized resin-sealed semiconductor device having outer terminals made from solder balls disposed like a lattice on the bottom face. SOLUTION: A small-sized resin-sealed semiconductor device is obtained by fixing a lead frame fixed through adhesives 7 to the bottom of a chip 1 having pads 8 at the periphery, sealing it with a resin so that protrusions on the opposite side of the lead frame to the chip mounting side are exposed after electric connection of the pads 8 to the lead frame through wires 3, and mounting solder balls on the exposed protrusion 5 to form the balls like a matrix on the bottom face. |
