| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent an inner lead from being cut during inner lead bonding. SOLUTION: A solder resist layer 27 is adhered to the main surface at the pellet side of an inner lead 24 prior to the inner lead bonding, an inner lead 24 is inner lead bonded to a pad 12 by a connecting portion 14 formed from a bump with a solder resist layer 27 being contacted to the main surface at the pad 12 side of a pellet 10. The inner lead 24 is reinforced by a solder resist layer 27, and the thickness of a contact portion 27b of the solder resist layer 27 becomes larger, and the inner lead 24 is not bent into S-shape, so that the breaking of the inner lead can be prevented. By so doing, the insulation of the inner lead is not degraded, even though it makes contact with the pellet and the solder resist layer is an insulation layer. The thickness of TCP-IC can be made much smaller, their quality and reliability can be enhanced, and the TCP-IC can be made thinner and integrated highly with a size reduced considerably.</p> |
