| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated board with an inner layer circuit in which yield at the time of etching is made excellent. SOLUTION: One face of two substrates 10 whose both faces are equipped with metallic foil is mutually adhered through an adhesive layer 20, so that an adhered body 30 can be formed. Etching of metallic foil 11 of a part exposed on the surface of the adhered body 30 is carried out so that a circuit 15 can be formed. Then, a pre preg 40 is laminated in contact with the circuit 15, and a sheet body 50 is laminated outside, heated and pressed so that a pressed body 60 having the adhesive layer 20 at the central part can be formed. Then, the pressed body 60 is separated by the adhesive layer 20 so that two laminated boards 70 with an inner layer circuit can be manufactured. |
