RESIN SEALED-TYPE ELECTRONIC CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To prevent deterioration of a brazing material in a resin sealed-type electronic circuit device which has a structure wherein a semiconductor element is brazed to a metal plate support with the simultaneous bonding of a circuit board thereto. SOLUTION: A groove 22 is provided on a support plate 11 so as to divide the surface thereof into two halves. A semiconductor element 12 is stuck to one half divided by the groove 22 on the support plate 11, by using a brazing material (a solder) 13. A circuit board 14 is stuck to the other half divided by the groove 22 on the support plate 11, with the use of an adhesive 15 made of thermoplastic resin. The circuit board 14 is covered with a protection resin layer 17 made of silicon rubber. A resin sealant body 19 made of epoxy based resin is provided in the support plate 11.