| 摘要 |
PROBLEM TO BE SOLVED: To protect an insulating board on which semiconductor chips are mounted from crackings caused by the difference in heat expansion coefficient between metal and the insulating board even if heat-cycle is applied to a semiconductor device. SOLUTION: A semiconductor device is composed of a circuit assembly unit which has a metal base plate 1 and semiconductor chips 3 mounted on the metal base plate 1 with an insulating board 2 therebetween, an enclosing resin case 7 which has a top cover 7a, encloses the circuit assembly unit and is fixed to the metal base plate and outer lead terminals 5 which are incorporated in the resin case and connected to the circuit assembly with wires 6 and, further, inside of the resin case is filled with filler 8. The tip leg parts 5a of the outer lead terminals 5 are laid in parallel with the insulating board 2 and fixed to another insulating board 9 which is so provided as not to be fixed to the metal base plate and, in this state, the tip leg parts 5a of the outer lead terminals are connected to the conductor patterns of the semiconductor chips and the insulating board with the wires 6. With this constitution, stresses caused by the expansion and contraction of the outer lead terminals are not applied to the insulating boards 2 and 9 to avoid crackings. |
