| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate connecting structure capable of offering stable connecting condition by effectively reinforcing a soldered part of a board to board connector. SOLUTION: A connector 200 which is provided on a wiring board or substrate 100 has an insulator 210, contacts 220, 220A and a reinforcing contact 230. The contact 220A and the reinforcing contact 230 which are provided at a corner of the insulator 210 are soldered on a common land part 110A provided at the wiring substrate 100. The contact 220A and the reinforcing contact 230 are electrically connected in the insulator 210. Another contact 220 is individually soldered at the land part 110. It is possible to prevent the occurrence of a connecting failure depending on a rupture by strengthening a connecting strength of the common land part 110A where the contact 220A and the reinforcing contact 230 are soldered. |
