| 摘要 |
PROBLEM TO BE SOLVED: To obtain an IC device for the manufacture of IC card by a method wherein the IC chip 3 and bonding wires of an IC module are sealed with a silicone rubber film. SOLUTION: A partially cured silicone rubber film is put on the IC chip 3 and bonding wires 4 of an IC module and then the IC chip 3 and the bonding wires 4 are enclosed by a mold frame. Then the film is pressed to deform so as to fit to the inside shape of the mold frame. Then the film is cured and the IC chip 3, etc., are sealed with the silicone film 11 to obtain an IC device 10. The IC chip 3, etc., are protected from moisture, vibration, etc., by the cured film 11. |
