| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the attachment of a movable part and a fixed part, by covering the respective facing surfaces of the movable part and the fixed part with an insulating film, which prevents the adhesion of the movable part to the fixed part. SOLUTION: On the upper surface of a substrate, a beam structure (movable part) 2A which is formed by separating single crystal silicon (single crystal semiconductor material) by a groove, and a fixed part 2B, are arranged. The beam structure 2A and the fixed part 2B are constituted of a silicon substrate, wherein impurities such as phosphorus are diffused. The surface thereof is covered with a silicon nitride film as an insulating film. Since the surfaces of the beam structure 2A and the fixed part 2B is covered with the silicon nitride film, the attachment of both parts can be prevented even when the beam structure 2A and the fixed part 2B are brought into contact, e.g. movable electrodes 7a-7d and 8a-8d and fixed electrodes 9a-9d, 11a-11b, 13a-13d and 15a-15b are brought into contact.</p> |
