发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR AND LEAD FRAME EMPLOYED THEREFOR
摘要 <p>PROBLEM TO BE SOLVED: To prevent a zigzag in-line package IC from being shaped in the legs of a crab. SOLUTION: In a method for manufacturing a zigzag in-line package IC 32, a plurality of steps of tie bars are made in parallel to each other on the groups of outer leads 20L, 20S and each tie bar is cut between neighboring outer leads and is bent at the portions 15A, 16A, 17A where the tie bars are cut when the outer leads 20L, 20S are bent. Since the tie bars at both sides of the outer leads 20L, 20S are cut symmetrically, the portions 15A, 16A, 17A are formed symmetrically. When each outer lead is bent at the portions 15A, 16A, 17A, the outer lead is suitably bent along the center line thereof. This can prevent the groups of outer leads from being shaped in the legs of a crab and can suitably package the zigzag in-line package IC on a printed circuit board.</p>
申请公布号 JPH1126670(A) 申请公布日期 1999.01.29
申请号 JP19970189274 申请日期 1997.06.30
申请人 HITACHI LTD;HITACHI TOBU SEMICONDUCTOR LTD 发明人 SATO YUKIHIRO
分类号 H01L23/34;H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/34
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