SUBSTRATE HAVING GATE SLOT, METAL MOLD FOR MOLDING SEMICONDUCTOR PACKAGE, AND MOLDING METHOD

摘要

PROBLEM TO BE SOLVED: To make a degating process unnecessary which eliminates a gate part into which resin has flown, after resin molding at the time of semiconductor package manufacture. SOLUTION: A substrate 10 having a gate slot 30 corresponding to the gate of a metal mold is used on a resin path reaching a part adjacent to a resin molding part 101 of each chip pad 20 on the outer edge of the substrate 10. A metal mold for molding such a semiconductor package is divided into a first gate 50 wherein the gate of the metal mold is arranged on the side of a resin supply pot 78 or on the side of a runner 80 and a second gate 60 wherein the gate is arranged on the side of a cavity 74. A gate isolation part 76 is installed between the first gate 50 and the second gate 60. In a semiconductor package molding method using the above metal mold, the substrate 10 having the gate slot 30 is introduced in the metal mold, resin molding is performed, and singulation process wherein individual semiconductor chips are separated by omitting a degating process is executed.