| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a package for a semiconductor wafer, wherein a wafer cassette is readily unloaded from a container body, good sealing property is realized, strength does not deteriorate at all, and the possibility of contamination on a semiconductor waver is reduced. SOLUTION: A semiconductor wafer package 10 has a first opening and closing member 11, a second opening and closing member 12, and a wafer cassette 13 which supports a plurality of semiconductor wafers in parallel. A holding hoard part 13b is formed at the center of the right and left side surfaces of the wafer cassette 13 and a holding recessed hole 13e, which corresponds to a holding part wherein a finger part of a robot or a finger of an operator is inserted, is formed in the holding board part 13b. The second opening and closing member 12 is formed so as to completely expose the holding recessed hole 13e of the wafer cassette 13 to the outside from the opening end edge of the second opening and closing member 12, when the water cassette 13 is contained in the second opening and closing member 12 and a container body is opened.</p> |
