| 摘要 |
PROBLEM TO BE SOLVED: To provide the photosensitive polymer composition good in photosensitivity and flattened in circuit level difference and the electronic parts capable of forming a similar interlayer insulating film or a similar surface protective film, and the electronic parts having the similar multilayer circuit structure. SOLUTION: This photosensitive polymer composition contains a polyimide resin precursor having repeating units each represented by the formula in which each of R<1> and R<4> is an aromatic group; each of R<2> and R<3> is an H atm or a univalent organic group and at least some parts of them in the repeating units contain polyimide resin precursor of hydrocarbon group; R<5> is an H atom or a hydrocarbon group; and (n) is 1, 2, or 3. The electronic parts are manufactured by coating a substrate with this photosensitive polymer composition to form a resin film, exposing and developing it, and then, curing it to form the interlayer or the surface protective layer, or coating with this composition to form a resin film, then exposing and developing it, forming a via hole and curing the the resin film to form the interlayer insulating layer on which upper circuit layer is formed one or more times to form multilayer circuit structure. |
