SOLDER LEVELING DEVICE FOR PRINTED WIRING BOARD,申请号JP19970178431-传众专利搜索

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发明名称	SOLDER LEVELING DEVICE FOR PRINTED WIRING BOARD
摘要
申请公布号	JPH1126915(A)	申请公布日期	1999.01.29
申请号	JP19970178431	申请日期	1997.07.03
申请人	NEC TOYAMA LTD	发明人	KAWAHARA TAKESHI
分类号	H05K3/34;B23K1/00;B23K1/08;H05K3/24;(IPC1-7):H05K3/24	主分类号	H05K3/34
代理机构		代理人
主权项
地址

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