| 摘要 |
<p>A method and apparatus for an integrated circuit package is provided. The integrated circuit package is designed for coupling an integrated circuit (140) to a printed circuit board. The integrated circuit package includes a base (110) having a bottom and a side. A flex circuit (130) having traces (135) therein is coupled to the leads (145) of the integrated circuit. The traces further are designed to couple to traces on the printed circuit board.</p> |
