SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To avoid wrong read or write of stored information in a semiconductor integrated circuit by forming wirings connected to test circuits on dicing lines and forming an Al pattern as a cover thereon. SOLUTION: On remaining parts of dicing lines 6 a wiring 22 (e.g. polysilicon film) connected to test circuits 16, wiring 24 (e.g. polysilicon film) connected to testing pads 18a, 19b, dummy wiring 26 (e.g. polysilicon film) are formed. The wiring 22 connected to the circuits 16 is covered with a protective pattern 28 to block a probe needle from contacting the wiring 22 if wrong read or write is tried by probing the wiring 22. This prevents wrong read or write for information stored in the LSI body 4 by driving the test circuits 16.