| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a suction-holding device which can reduce the load on the operator's operation and does not contaminate clean environment. SOLUTION: A hollow drive shat 15 is arranged inside a holding part 11 rotatatively, and a vacuum pat 22 is attached to a tip part of the drive shaft 15 through a hollow rod 21. Negative pressure sucked to a vacuum pump side is introduced to an air conduction part 15a of the drive shaft 15 via a tube 17 and can suck a semiconductor wafer, for example, in the one side surface of the vacuum pat 22. Meanwhile, negative pressure sucked to the vacuum pump side is also introduced into an annular ring body 12, formed in a tail end part of the holding part 11 via a tube 30a (30b). In the annular ring body 12, an actuator which rotates and operates an inner side part thereof circumferentially through a negative pressure is arranged, and the actuator is combined with the drive shaft 15. Therefore, a vacuum pat 22 is driven in reverse in the range of approximately 180 deg., based on the rotating operation of an actuator and the both sides of a semiconductor wafer can be visually inspected.</p> |
