IC MODULE, METHOD OF FABRICATING THE SAME AND IC CARD PROVIDED WITH IC MODULE

摘要

A method for fabricating an IC module (1) including a resin packaging step conducted by using top and bottom forces (5) defining a cavity (50) in a clamped state, wherein the packaging step comprises placing a substrate (2) on which an IC chip (3) is mounted and a winding coil (20A) having a doughnut-like planar shape and a flat overall shape in a cavity (50) and injecting a molten resin into the cavity (50). When resin packaging is conducted on a substrate (2) on which an antenna coil (20) is patterned, spacers (28) having a height equal to or substantially equal to that of the cavity (50) are provided on the substrate (2), which is then placed in the cavity (50) and packaged by injecting the molten resin. Alternatively, the substrate (2) in the cavity (50) may be vacuum-clamped. The IC chip (3) and the antenna coil (20) can be well protected by such a method.