METHOD AND DEVICE FOR PRODUCING A CHIP-SUBSTRATE ASSEMBLY

摘要

The invention relates to a method and a device for producing a chip-substrate assembly by alloying or hard-soldering, using a solder containing two or more components with at least two component parts X and Y containing metal. The first component part X has gold or a similar precious metal, and the second component Y is used in the soldering process by reacting or dissolving it in the materials or layers which are to be joined. The solder has a hypereutectic concentration of second component Y. The invention also relates to a solder for the production of a chip-substrate assembly, in addition to a semiconductor component with a semiconductor chip (1) secured to a substrate by alloying or hard-soldering.