| 摘要 |
Nonmetallic materials (18, 28) are welded without solder or adhesive by a laser (202) and preferably fiber optics (204) that direct laser light (220) through one of the materials (18) to create a seam weld. Through use of fiber optics the beam is optimally (Fig. 11) converted to heat, avoiding weld flaws due to underheating and material damage due to overheating. Welding is rapid and reproducible even for the smallest of contact geometries, achieving for example strong solderless gold-to-gold compression laser welding of a silicon substrate (28) to a polymeric (e. g. polyimide) flex circuit tape (18), without tape damage. The bond can be between a straight gold-bond line (210, Figs. 20-22ÄCÜ), or complex weld seam pattern (210, Figs. 17-19ÄCÜ), on the tape and a mating gold bond line or pattern (Figs. 17-22ÄAÜ) 208 on a semiconductor chip (28). In an inkjet printhead the result is to avoid delamination and nozzle skewing, associated in other methods with adhesive curing. Reduced skew provides less dot-placement error and thus better print quality. Better head configuration facilitates fixing a nozzle member to the substrate, and increasing nozzle area stiffness, nozzle camber angle and directionality, and substrate-to-tape bond strength-reducing deformation and so consistently raising ink refill speeds, and reducing ink trajectory errors and delamination. In particular embodiments, increased tolerance to aggressive solvents in inks, and more consistent chamber geometry, result in better drop-volume control, better pen quality, repeatability and reliability; and cutting down of process steps, processing time, cost, and in-process handling. These in turn provide ease of assembly, higher yields and reliability, ease of nozzle serviceability, and overall material and manufacturing cost reduction. <IMAGE> |
