Test probe for semiconductor devices and method of manufacturing of the same

摘要

A test probe for semiconductor devices is disclosed, the test probe (1) having a tip portion which is adapted to be pressed against a test pad (2) of a semiconductor device to establish electrical contact between the tip portion and the pad (2) for testing the operation of the semiconductor device, wherein the probe (1) is formed to have a tip shape with an angle of not less than 15 DEG formed at the surface of the pad (2) between a tangential line (4) with respect to a tip face of the probe (1) and the pad surface when the probe (1) is pressed against the pad (2), the tip shape of the probe (1) having a spherical surface meeting the relationship of: $where\; the\; radius\; of\; curvature\; of\; the\; spherical\; surface\; is\; R,\; the\; thickness\; of\; the\; pad\; is\; t,\; and\; the\; angle\; formed\; at\; the\; pad\; surface\; between\; the\; tangential\; line\; (4)\; with\; respect\; to\; the\; probe\; tip\; face\; and\; the\; pad\; surface\; when\; the\; probe\; is\; pressed\; against\; the\; pad\; is\theta ,\; the\; probe\; having\; a\; flat\; portion\; (51)\; at\; an\; end\; of\; the\; tip\; portion.\; Accordingly,\; a\; contact\; surface\; can\; be\; established\; between\; the\; probe\; (1)\; tip\; and\; the\; pad\; (2)\; with\; a\; sufficient\; degree\; of\; electrical\; continuity,\; and\; when\; the\; probe\; level\; is\; adjusted\; in\; the\; probing,\; a\; time\; required\; for\; positioning\; the\; probe\; (1)\; prior\; to\; the\; starting\; of\; measurement\; is\; cut\; down\; and\; variation\; in\; measurement\; are\; reduced.\mathop{\mathrm{image}}$