<p>A data medium in card form has a least one semiconductor memory element with a storage capacity of at least one megabit and has electroplated contacts for transmission of data between a data processing system the semiconductor memory elements of the data medium. Electrical conductor paths on the data medium connect the semiconductor memory element to the electroplated contacts. The electrical conductor paths are a single leadframe on which at least parts of the electroplated contacts are integrally formed. The leadframe is formed of a resilient material.</p>
申请公布号
EP0818024(B1)
申请公布日期
1999.01.27
申请号
EP19960905735
申请日期
1996.03.15
申请人
SIEMENS AKTIENGESELLSCHAFT
发明人
HOUDEAU, DETLEF;KIRSCHBAUER, JOSEF;FILSER, CHRISTOPH