发明名称 |
Three-dimensional multi-chip module having stacked semiconductor chips and process of fabrication thereof |
摘要 |
A plurality of semiconductor chips (21a-21d) are sequentially bonded to one another so as to form a stacked semiconductor chip structure (21), and the stacked semiconductor chip structure is accommodated in a cavity (22a) formed in an insulating carrier (22); while the semiconductor chips (21a-21d) are being sequentially stacked, a conductive pattern (22c) formed on the bottom surface of the insulating carrier is connected to electrodes (21h/21i) on each of the semiconductor chips through bonding wires (23), and the three-dimensional multi-chip module is only slightly higher than the stacked semiconductor chip structure. <IMAGE> |
申请公布号 |
EP0736903(A3) |
申请公布日期 |
1999.01.27 |
申请号 |
EP19960105469 |
申请日期 |
1996.04.04 |
申请人 |
NEC CORPORATION |
发明人 |
SENBA, NAOJI;SHIMADA, YUZO |
分类号 |
H01L23/12;H01L23/24;H01L25/065;H01L25/07;H01L25/10;H01L25/18 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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