| 摘要 |
A soldering device for soldering lead wires from a disc head to a circuit of the disc drive includes a heat shield adapted to provide a protective barrier for a soldering tip during operation of a soldering instrument. During operation, the soldering tip is heated by a heating element for use. A heat shield is coupled with the soldering tip and designed to provide a temperature barrier along the length of the soldering tip and prevent damage to other wires in close proximity.
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