| 摘要 |
PROBLEM TO BE SOLVED: To perform the uniform treatment by a treating liquid by supplying the liquid to a wafer uniformly. SOLUTION: After a developer supply nozzle 21 begins to move, a pump for a developer supply source 24 is started earlier by a specified time than the time at which the slit 21a of the developer supply nozzle 21 reaches one of the ends of a base W and a variable valve 25 is rapidly opened to switch an operation from a non-liquid supply state to a liquid supply state. At a time T2 when the slit 21a of the nozzle 21 reaches the other end of the wafer W, the variable valve 25 is gradually closed to switch, step by step, from the liquid supply state to the non-liquid supply state and the pump for the developer supply source 24 is stopped. Thus it is possible to gradually decrease the developer to be discharged from the nozzle 21 to the wafer W side, so that the developer is prevented from being ejected inertially from the inside of an area near the slit 21a of the nozzle 21. Therefore, the formation of an unintentional defective development part on a resist coat is prevented from occurring. |
