| 摘要 |
A method of and an apparatus for coating a photoresist film over a wafer, capable of eliminating local non-uniformity of the photoresist film and uniformly controlling the thickness of the photoresist film. The method includes the steps of vaporizing and injecting a liquid photoresist material to form photoresist particles, electrically charging photoresist particles, establishing an electric field in an area where the photoresist particles flow, thereby deflecting the photoresist particles, and selectively taking the photoresist particles passing through a desired zone, and depositing the selected photoresist particles over the wafer. The apparatus includes a Venturi tube for pumping up a liquid photoresist material and injecting the pumped photoresist material in a vapor phase, a first insulating tube adapted to disperse the photoresist particles formed upon injecting the liquid photoresist material, electrodes coupled to a voltage source and adapted to deflect the flow direction of the photoresist particles, a second insulating tube adapted to pass the photoresist particles deflected by the electrode therethrough, and a third insulating tube adapted to take only a portion of the photoresist particles emerging from the second insulating tube.
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