发明名称 PHENOLIC RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition maintaining the original characteristics of a phenolic resin, such as heat resistance, improved in balance between the flowability of the composition on its molding and the hardening rate of the composition after charged into a mold, and useful for a transfer molding method, etc., by including a specific phenolic resin and a small amount of a specific compound. SOLUTION: This phenolic resin composition comprises (A) 95-99.8 wt.% of a phenolic resin (e.g. a phenolaralkyl resin of formula II) represented by formula I [R1 is H, a halogen, etc.;ϕis a benzene ring; (n) is 0-100], having sulfate groups extracted with 10 fold-volume of 95±5 deg.C water in amount of <=20 ppm, and further having a number-average mol.wt. of 600-3,000 and a weight-average mol.wt. of 1,000-20,000, and (B) 0.2-5 wt.% of a compound such as a para-toluene sulfonic acid of formula III (R2 is H or an alkyl; Ar1 is phenyl or naphthyl; R3 is H, methyl, etc.), and is obtained, e.g. by dissolving the component B in the component A melted at 80-130 deg.C.
申请公布号 JPH1121417(A) 申请公布日期 1999.01.26
申请号 JP19970179912 申请日期 1997.07.04
申请人 MITSUI CHEM INC 发明人 SHINDO YOSHIYUKI;TAJIMA TAKUO;URAGAMI TATSUNOBU;TAKUMA HIROSUKE;TANAKA KOZO
分类号 C08K5/42;C08L61/06;(IPC1-7):C08L61/06 主分类号 C08K5/42
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