| 摘要 |
Apparatus for limiting the rotation of a deposition ring relative to a substrate support. Specifically, the deposition ring is rotatably affixed to the substrate support. In a first embodiment of the apparatus, an anti-rotation pin is affixed to a deposition ring that circumscribes a substrate support such as an electrostatic chuck. An anti-rotation bracket is attached at a first end to the substrate support. A second end is coupled to the anti-rotation pin. As such, the deposition ring has some degree of freedom to adjust to thermal expansion of the deposition ring and the substrate support; however, the deposition ring is prevented by the interaction of the anti-rotation pin and bracket from rotating to a point where the deposition ring becomes stuck to the substrate support. In an alternative embodiment of the apparatus, a anti-rotation pin or bump is formed on the underside of the deposition ring. A matching indentation is formed on a radially extending, circumferential flange extending from the substrate support and supporting the deposition ring. The pin and indentation interact to limit the amount of rotation that can be attained by the deposition ring.
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