发明名称 |
Method and slurry composition for chemical-mechanical polish (CMP) planarizing of copper containing conductor layers |
摘要 |
A Chemical-Mechanical Polish (CMP) planarizing method and a Chemical-Mechanical Polish (CMP) slurry composition for Chemical-Mechanical Polish (CMP) planarizing of copper metal and copper metal alloy layers within integrated circuits. There is first provided a semiconductor substrate having formed upon its surface a patterned substrate layer. Formed within and upon the patterned substrate layer is a blanket copper metal layer or a blanket copper metal alloy layer. The blanket copper metal layer or blanket copper metal alloy layer is then planarized through a Chemical-Mechanical Polish (CMP) planarizing method employing a Chemical-Mechanical Polish (CMP) slurry composition. The Chemical-Mechanical Polish (CMP) slurry composition comprises a non-aqueous coordinating solvent and a halogen radical producing specie.
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申请公布号 |
US5863307(A) |
申请公布日期 |
1999.01.26 |
申请号 |
US19980080804 |
申请日期 |
1998.05.18 |
申请人 |
CHARTERED SEMICONDUCTOR MANUFACTURING, LTD. |
发明人 |
ZHOU, MEI SHENG;CHU, RON-FU |
分类号 |
C09K3/14;H01L21/321;H01L21/768;(IPC1-7):B24D3/34 |
主分类号 |
C09K3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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