| 摘要 |
PROBLEM TO BE SOLVED: To prevent generation of a bulge of an external connecting terminal by removing moisture absorbed to an insulating resin board and adhesive material before resin-sealing the element, thereby suppressing generation of void at a lower side of the element. SOLUTION: A supplying metal magazine 16 is conveyed to a supply position in the state that the magazine 16 is contained in an oven 21. A heater 24 having a temperature control function of heating and drying and a fan 25 for circulating heat in the oven 21 to make it at uniform temperature are arranged in the oven 21. Accordingly, when the magazine 16 is contained in the oven 21, the magazine 16 removes moisture absorbed to an insulting resin bard 4 and adhering material in a semiconductor device 1 by the heat in the oven 21. Thus, at the time of resin molding, generation of void in a lower part of a semiconductor element 5 is suppressed to prevent generation of a bulge of an external connecting terminal part. |
