| 摘要 |
<p>PROBLEM TO BE SOLVED: To shorten a washing process after polishing a mirror finished surface by providing a polish liquid supplying means with a deaerating means for eliminating dissolved oxygen from the polish liquid. SOLUTION: Polish liquid supplied from a tank passes through each unit 6a, 6b, 6c in this order, and during the passing, deaerating treatment is performed to this polish liquid three times so as to change it to the low dissolved oxygen polish liquid, and it is injected toward a polish pad 3 from a nozzle 1. When the low dissolved oxygen liquid is injected toward the polish pad 3 from the nozzle 1, a top ring 4 is turned around a shaft thereof, and lowered till a lower surface of a wafer substrate W is pushed to the polish pad 3. Surface of the wafer substrate W is washed simultaneously with the polish by the pushing force to the top ring 4 and the chemical washing work of the low dissolved oxygen polish liquid.</p> |
