| 摘要 |
PROBLEM TO BE SOLVED: (J) To improve the sealing workability and adhesion to electronic devices by providing a heat- and/or light-curable adhesive layer composed primarily of an ethylene-vinyl acetate copolymer on one or both sides of a substrate film having a specific light transmittance and refractive index. SOLUTION: To 100 pts.wt. of an ethylene-vinyl acetate copolymer containing 10-50 wt.% of vinyl acetate, are blended 0.1-10 pts.wt. of a photosensitizer, 0.1-10 pts.wt. of an organic peroxide having a decomposition temperature of 50 deg.C or above at a half-life of 10 hours, 0.01-5 pts.wt. of a silane coupling agent, 0.1-50 pts.wt. of a (meth)acryloyl-containing compound and/or allyl-containing compound, and 1-200 pts.wt. of a hydrocarbon resin, so that a heat- and/or light-curable adhesive is obtained. The adhesive is applied on one or both sides of a substrate film having a light transmittance of 50% or more, a refractive index of 1.8 or less, a Young's modulus of 1 kg/cm<2> or more and a thickness of 1-1,000μm and cured to form an adhesive layer, on the surface of which unevenness with an average roughness of 50μm are formed.
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