| 摘要 |
A thermosyphon-powered jet-impingement cooling device delivering superior thermal energy dissipation for compact heat sources such as electronic devices. Thermal energy from a heat source travels through the heat source/heat spreader plate interface to the heat spreader plate and heat spreader plate extended surface. Thermal energy is transferred by convection to a single or two-phase coolant media. The heated and/or boiling, less dense coolant begins to expand and rise. The rising coolant or vapor approaches a cold plate and velocity slows due to the greater cross-sectional flow area. The coolant heat energy is released by convection or condensation to the heat dissipation/fluid interface surface, and is then conducted through the cold plate, across the cold plate/heat dissipating device thermal interface, and then to the heat dissipating device. As the cooled media contracts and/or condenses to form droplets, the coolant or droplets begin to fall. As heated or boiling coolant continues to rise, the falling coolant or droplets are both pushed from the high pressure (heated) annulus and pulled from the low pressure (cooled) center through an impingement jet orifice. The coolant impinges against a concave heat/fluid interface surface. The impinging jet of coolant media of the present invention greatly reduces the thermal boundary layer at the point of impingement.
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