发明名称 Semiconductor array with self-adjusted contacts
摘要 A semiconductor array with self-adjusted contacts includes a substrate having a surface, at least two mutually spaced-apart doped regions extending in a first lateral direction on the surface, and insulated regions each being associated with a respective one of the doped regions and extending in the first lateral direction on the same side. Contact surfaces each extend in the first lateral direction above a respective one of the doped regions and at least partially above the insulated region associated with the one doped region. An insulating layer has contact holes each being formed therein above a respective one of the contact surfaces for receiving a self-adjusted contact. A method for producing a semiconductor array with self-adjusted contacts includes producing one of the contact surfaces with a first fragment being a part of the contact surface extending above the doped region and a second fragment being a part of the contact surface extending above the insulated region. The first fragment is produced with a non-photolithographic process avoiding edge location errors. The second fragment extends above the first fragment and therefore above the doped region by at least a length of a maximum edge location error, as long as no edge location errors occur.
申请公布号 US5864155(A) 申请公布日期 1999.01.26
申请号 US19960651305 申请日期 1996.05.23
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 MELZNER, HANNO
分类号 H01L23/522;H01L21/336;H01L21/768;H01L21/8242;H01L27/108;H01L29/78;(IPC1-7):H01L27/108;H01L29/76 主分类号 H01L23/522
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