Lead-free solder compositions

摘要

Electrical solder compositions (by weight percent) having between 91.5-96.5% Sn; 2-5% Ag; 0.1-3% Ni; and 0-2.9% Cu; and having a melting temperature 220 DEG C. or less. The solder compositions have microstructure with uniformly dispersed fine grains of Sn-Ni, Sn-Cu and Sn-Cu-Ni intermetallic phases that provide resistance to grain growth during thermal cycling.