发明名称 Semiconductor device and method for manufacturing the same
摘要 A semiconductor device and a method for manufacturing the same, in which a leak current generated in a pn junction formed between a silicon substrate and an epitaxial layer can be reduced. A silicon oxide film is formed on a silicon substrate having a (100) crystal plane. The silicon oxide film is patterned to form an opened portion and an inclined surface on a pattern edge of the silicon oxide film. The inclined surface forms an angle of 54.74+/-5 DEG with the silicon substrate. An epitaxial layer is formed in the opened portion by selective epitaxial growth.
申请公布号 US5864180(A) 申请公布日期 1999.01.26
申请号 US19980028672 申请日期 1998.02.24
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 HORI, SHIZUE;BABA, YOSHIRO;SUGAYA, HIROYUKI;NARUSE, HIROSHI
分类号 H01L21/205;H01L21/20;H01L29/04;(IPC1-7):H01L21/36 主分类号 H01L21/205
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