发明名称 |
Semiconductor device and method for manufacturing the same |
摘要 |
A semiconductor device and a method for manufacturing the same, in which a leak current generated in a pn junction formed between a silicon substrate and an epitaxial layer can be reduced. A silicon oxide film is formed on a silicon substrate having a (100) crystal plane. The silicon oxide film is patterned to form an opened portion and an inclined surface on a pattern edge of the silicon oxide film. The inclined surface forms an angle of 54.74+/-5 DEG with the silicon substrate. An epitaxial layer is formed in the opened portion by selective epitaxial growth.
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申请公布号 |
US5864180(A) |
申请公布日期 |
1999.01.26 |
申请号 |
US19980028672 |
申请日期 |
1998.02.24 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
HORI, SHIZUE;BABA, YOSHIRO;SUGAYA, HIROYUKI;NARUSE, HIROSHI |
分类号 |
H01L21/205;H01L21/20;H01L29/04;(IPC1-7):H01L21/36 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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