发明名称 FORMING METHOD OF OUTER ELECTRODE OF ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To enable the outer electrode of an electronic component to be well connected to a connection object such as the electrode of a board or the like by a method, wherein a protrudent part is provided to the surface of the electronic component in one piece, and an outer electrode is formed on the surface of the protrudent part. SOLUTION: Two projections 5 each semicircular in cross section are provided separating from each other in a lateral direction to each of the widthwise opposite sides of a device main body 4 so as to extend in a vertical direction. Then, silver powder-containing electrode paste 7 which can be baked is applied onto the surfaces of the projections 5 of the device main body 4. The device main body 4, where electrode paste is applied is introduced into a heating furnace, the device main body 4, a conductor which forms a coil, and the electrode paste 7 are baked collectively, and the outer electrodes 7 crosswise opposite to each other and inner coils are connected together respectively to obtain an inductor array.
申请公布号 JPH1116760(A) 申请公布日期 1999.01.22
申请号 JP19970164475 申请日期 1997.06.20
申请人 TAIYO YUDEN CO LTD 发明人 HATTORI MASAYUKI
分类号 H01F41/10;H01F27/29;H01G13/00;H05K1/00;H05K3/34;H05K3/40 主分类号 H01F41/10
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