| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance the reliability and productivity of a package of a structure, wherein circuit boards smaller than IC chips are made a flip-chip connection with the IC chips, by a method wherein external terminals on the IC chips and bonding pads on the circuit boards are made a flip-chip connection with each other and the parts between the IC chins and the circuit boards are sealed with a sealing resin. SOLUTION: In a bonding process, a flux is applied on bonding pads on circuit boards 1, which are smaller than IC chips 5 and are split into single pieces. After the circuit boards 1 split into the single pieces are mounted on solder bumps 7 on a wafer 5a arranged with the chips 5 of the component of a plurality of pieces one by one, a flip-chip mounting of the bonding pads on the boards 1 to the solder bumps 7 is performed by going through a solder reflow process. In a resin sealing process, a sealing resin injection space is easy to take by injecting a sealing resin 8 between the adjacent circuit boards 1 and the resin 8 easily flows in between the boards 1 and the chips 5. Moreover, in a dicing process, the resin 8 is cut simultaneously with the wafer 5a and the cut surfaces of the resin 8 are exposed on the outer peripheral side surfaces of the boards 1.</p> |
