| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for mounting a semiconductor chip which is improved about the connection reliability and superior in mass production. SOLUTION: The substrate for mounting a semiconductor chip 3 having terminals through adhesives 9 comprises, on its surface, terminals 5 to be connected to terminals of the chip 3, wiring conductors led from the terminals 5 and insulation coat covering the wiring conductors. Openings 2 without insulation coating are provided at regions for mounting the chip 3, and the size of each opening 2 of the coat is smaller than the chip 3 about 20-300μm.
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