SURFACE-MOUNT ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide surface-mount electronic components provided with a precise uniform external connecting terminal by eliminating the burr of an electrode film or suppressing the occurrence of the burr to the minimum by artificially making the semicircular shape of the recessed surface of the external connecting terminal smaller than a bisected circle. SOLUTION: A through-hole 5, which is formed through a substrate and has an electrode film on its internal surface, is divided into two nearly semicircular shapes by dicing the through-hole 5 with a rotary blade. One side of the divided semicircular through-holes 5 is used as a semicircular external connecting terminal 3 having a recessed surface. Then surface-mount electronic components having a plurality of external connecting terminals 3 thus formed are formed, and a height H of the semicircular arc of the internal surface of each terminal 3 is set at the difference between the radius of curvature R of the semicircular arc and a double thickness (2t) of the electrode film or smaller.