| 摘要 |
PROBLEM TO BE SOLVED: To perform baking processes of different temperature conditions with a single baking device, by rapidly reaching a target baking temperature while severely controlling a temperature. SOLUTION: A baking device 20 comprises a processing stage 22 where a wafer W is held for baking. The processing stage 22 comprises, for example, a temperature adjusting part which, formed of electron refrigeration element, adjusts the temperature of the wafer W. The baking device 20 comprises a heating part 23 provided on the processing stage 22, a temperature sensor 25 for measuring temperature of the heating part 23, and a control part 26 which, based on the measuring result of a temperature sensor 25, controls a power source 27 of the processing stage (temperature adjusting part) 22. |
