| 摘要 |
PROBLEM TO BE SOLVED: To position the spheric or semispheric electrodes of package parts without positional deviation by forming pads arranged on a substrate in a matrix-like state in annular shapes and heaping up solder on the pads in doughnut-like shapes, and then, mounting the electrodes on the heaped-up solder. SOLUTION: Pads 2 arranged on a substrate 1 are formed in annular shapes. The heights of the annular bodies of the pads 2 are made higher by using solder so that the electrodes 13 of area array package parts 10 may be inserted surely into the internal spaces of the pads 2. Since each electrode 13 of the parts 10 is formed in a spheric or semispheric shape having the same diameter as its corresponding pad 2 has and a height of 300-400μm, the semispheric section of the electrode 13 gets in the central recessed section of the doughnut-like solder 3 and the parts 10 are positioned. Then the parts 10 are mounted by heating the solder and substrate 1 in a reflowing furnace.
|
