| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can secure flatness of an external lead 2B by preventing deformation of a shape (gull-wing) of the external lead 2B caused by an external force. SOLUTION: In the semiconductor device, leads 2 are fixed to an insulating film 3, electrodes of a semiconductor chip 1 are electrically connected to inner leads 2A of the leads 2 through bump electrodes 5, and the film 3, the inner leads 2B of the leads 2 and semiconductor chip 1 are sealed with a resin sealing material 6. The external leads 2B are made in the form of a predetermined shape, and upper surfaces of the external leads 2B are covered with the resin sealing material 6. |
