| 摘要 |
<p>PROBLEM TO BE SOLVED: To increase both the adhesive strength and solder wettability of surface electrodes formed on the surface of a ceramic substrate and to eliminate the foaming property of the electrodes, warping and cracking of the substrate by simultaneously baking the ceramic substrate and surface electrodes. SOLUTION: After surface electrodes and over glaze or internal electrodes are formed on each dielectric sheet and over grazes and surface electrodes are printed on supporting bodies (films) (S1), the supporting bodies are removed from the sheets and dielectric sheets are stacked (by thermocompression bonding) (S2). After the dielectric sheets are thermocompression-bonded in the above- mentioned way, the sheets are baked for 16 hours at 960 deg.C (S3). Thereafter, end-section electrodes are provided on the side face of a ceramic substrate (S4) and the electrodes are baked (S5). Therefore, the adhesive strengths between the ceramic substrate and surface electrodes can be increased and excellent plate-precipitating property can be obtained, because the foaming problem, etc., of the surface electrodes and the warping and cracking of the ceramic substrate are eliminated. In addition, the manufacturing process of the ceramic substrate can be simplified.</p> |
