| 摘要 |
PROBLEM TO BE SOLVED: To suppress the warp of a molded product and minimize the internal stress due to mounting on a heat sink to realize a high reliability and ensure a low thermal resistance, by specifying the linear expansion coefficient ratio of a metal board to a resin mold. SOLUTION: A device has a power semiconductor element 11 fixed to a lead frame 13 through a solder layer. The lead frame 13 is adhered to a metal board 19 through an insulation layer 18, the element 11 is electrically bonded by an Al wire bonding part 16 and molded with an armor resin mold 17 to form an integrated structure, and the linear thermal expansion coefficient of the resin mold 17 is adjusted relative to that of the board 11 in a ratio of 0.3:1-0.6:1 in the actual temp. range. Thus, the warp of the molded product is suppressed, and hence the internal stress due to mounting on a heat sink, etc., is minimized. |
