发明名称 |
POSITIVE PHOTORESIST COMPOSITION FOR FORMING CONTACT HOLE AND METHOD FOR FORMING CONTACT HOLE |
摘要 |
PROBLEM TO BE SOLVED: To provide the positive photoresist composition for forming the contact holes and the method for forming the contact holes capable of forming a contact hole pattern sufficiently matching a mask pattern small in dimples with respect to the technique for forming the contact holes using a phase shift method. SOLUTION: This positive photoresist comprises (A) an alkali-soluble resin, (B) a compound having a quinonediazido group, and (C) a solvent, and the component (B) contains at least one kind of the naphthoquinonediazidosulfonic acid ester of the polyphenol compound in which 4-6 benzene rings combine through each methylene chain with each other and the first benzene ring linking to the meta position of the next benzene ring and so forth and each benzene ring has a hydroxy group. |
申请公布号 |
JPH1115151(A) |
申请公布日期 |
1999.01.22 |
申请号 |
JP19980117222 |
申请日期 |
1998.04.27 |
申请人 |
TOKYO OHKA KOGYO CO LTD |
发明人 |
KURIHARA MASAKI;NIIKURA SATOSHI;KOBAYASHI YOSHINORI;DOI KOSUKE;OBARA HIDEKATSU;NAKAYAMA TOSHIMASA |
分类号 |
G03F7/004;G03F7/022;H01L21/027;(IPC1-7):G03F7/022 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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