发明名称 PROCESSOR
摘要 PROBLEM TO BE SOLVED: To facilitate insertion of a substrate into the recesses in nozzle bodies and enable removal of treatment liquid from the periphery of the substrate even if the peripheral portion of the substrate is warped, by moving the nozzles, which supply solvent to the peripheral portion of the substrate inserted into the recesses, along the peripheral portion of the substrate, and guiding the peripheral portion of the substrate to the inlet of the recesses in the nozzle bodies. SOLUTION: The nozzles 65-68 starts moving along the four side of a substrate G due to motor drive. Four rollers 121 are rotatably installed at the upper and lower corners of the inlet of the recesses 111 in the nozzle bodies 110. When the peripheral portion of the substrate approaches the inlet of the recesses 111, for the reason, the rollers 121 guide the peripheral portion of the substrate G into the recesses 111; therefore, the peripheral portion of the substrate G can be easily inserted into the recesses 111. When the peripheral portion of the substrate G has been inserted into the recesses 111 in the nozzles 65-68 in a non-contact manner, solvent is blown out of upper and lower blow holes 112, 113, 114 and blow holes 122, 123 for roller cleaning, and is sucked into and exhausted from a suction hole 118.
申请公布号 JPH1116831(A) 申请公布日期 1999.01.22
申请号 JP19980130969 申请日期 1998.04.27
申请人 TOKYO ELECTRON LTD 发明人 TATEYAMA KIYOHISA;KAWAGUCHI YOSHIHIRO
分类号 G03F7/42;B05C11/02;H01L21/027;H01L21/304;(IPC1-7):H01L21/027 主分类号 G03F7/42
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