| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the flatness of a resin sealed semiconductor device having a heat radiator by constituting the device of a material having a thermal expansion coefficient equal or approximated to the thermal expansion coefficient of resin in a resin sealing body. SOLUTION: A heat sink 1 is constituted of the material having the thermal expansion coefficient equal or approximated to the thermal expansion coefficient of resin in the resin sealing body 7. When the resin sealing body 7 is formed by a transfer mold, thermal stress owing to a difference between the resin sealing body 7 and the heat sink 1 can be relieved even if the resin sealing body 7 and the heat sink 1 are cooled to a regular temperature from the heating temperature of the mold. Thus, the deformations of warp and distortion, which occur in the resin sealing body 7 and the heat sink 1, can be suppressed and the flatness of the resin sealed semiconductor device can be improved. At the time of mounting the resin sealing-type semiconductor device on the mounting face of a mounting substrate, a connection failure between the electrode pad of the mounting substrate and the outer lead 4B of the resin sealed semiconductor device can be suppressed.</p> |
