发明名称 WIRING SUBSTRATE WITH INSERTED HEATING ELEMENT
摘要 <p>PROBLEM TO BE SOLVED: To suppress the temperature rise in land parts by a method, wherein the land parts of respective inserted heating elements are respectively and independently formed on a wiring substrate whereon multiple inserted heating elements are series-connected. SOLUTION: Metal-oxide film resistors 12, inserted heating elements, are arranged in series on a wiring substrate 11, while adjacent land parts wherein the leads 12a of respective metal-oxide film resistors 12 are solder-jointed with one another are respectively and separately independent. That is, respective metal-oxide film resistors 12 are arranged in the same long direction, while the land parts 13 of respective metal film resistors 12 are connected by the wiring printed in the wiring substrate 11. In such a constitution, the land parts 13 are respectively and separately independent at a specific interval, so that the heat generated by main bodies 12b of the resistors 12 are conducted to the independent land parts 13 through the intermediary of respective leads 12a, thereby enabling the temperature rise in the land parts 13 to be suppressed.</p>
申请公布号 JPH1116711(A) 申请公布日期 1999.01.22
申请号 JP19970168623 申请日期 1997.06.25
申请人 SONY CORP 发明人 MATSUMURA YOSHITOSHI;ODA KUNIO
分类号 H01C13/02;H01C7/00;H05K1/02;H05K1/11;H05K1/18;H05K3/34;H05K7/20;(IPC1-7):H01C13/02 主分类号 H01C13/02
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